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Time of Issue: Apr. 12, 2013 9:24:55
Period OF Validity: Apr. 12, 2014 9:24:55
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Application: Hexafluoroethane is used as a versatile etchant in semiconductor manufacturing. It can be used for selective etching of metal silicides and oxides versus their metal substrates and also for etching of silicon dioxide over silicon. The solar panel manufacturing industry is one of the major emitters of hexafluoroethane, which has a greenhouse gas potential 12,000 times greater than CO2.

Together with trifluoromethane it is used in refrigerants R508A (61%) and R508B (54%).

Product Specification

Name

Hexafluoroethane

CAS No.

76-16-4

MF

C2F6

EINECS No.

200-939-8

Grade

Purity

 Impurity content (ppm)

99.999%

O2≤0.5, N2 ≤0.5, CO ≤0.1, CO2≤0.1, Acidity≤0.003, Moisture≤0.1, Other Organics≤0.01

Physical Date

Molecular Weight

138.02 g/mole

Boiling Point

-108.8oF (-78.2oC)

Specific Volume

0.628931 ft3/lbs at 70oF

Vapor Pressure    

@70oF (21.1oC) = 445 psia (3068 kPa)

Liquid Density at Boiling Point

100.4 lb/ft3 (1608kg/m3)

Gas Density at 70oF. 1 atm

358 lb/ft3 (5.73kg/m3)

Solubility In Water

Very slightly soluble

Freezing Point

-149.3oF (-100.7oC)

Evaporation Rate

N/A (Gas)

Specific Gravity (Air=1)

@70oF (21.1oC) = 4.78

Appearance And Odor    Colorless, odorless gas.



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