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  Underfilled Adhesive 5219 More >> 

Time of Issue: Oct. 11, 2011 14:28:37
Period OF Validity: Nov. 10, 2011 14:28:37
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5219 Underfill is a kind of one component,fast curing epoxy filling agent.Curing Temperature is 120℃,excellent liquidity,filling the gaps below 25 microns ,viscosity consistent,high flexibility and maintained performace.

Mainly for filling and protection after the CSP;BGA and UBGA’s assembly.Such as:Mobile Phone and laptop.

 



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